Power module allows solder-free assembly

Semikron has released the MiniSKiiP IPM intelligent power module for quick and easy solder-free assembly.

The module has been developed for motor powers of up to 15kW and incorporates a latch-up free silicon on insulator (SOI) driver IC for reliable system operation.

The unit features thermal resistance of 0.95K/W and at junction temperature of +175C.

Power, control and auxiliary contacts are connected directly to the printed circuit board via springs, not solder joints.

This results in a higher quality of assembly.

Cost-efficient assembly of the module, printed circuit board and heat sink is achieved with simple snap-on mounting with one standard screw.

Handling is reduced and the parts count is lower than with discrete designs.

A high-voltage driver IC with advanced level-shifter technology is integrated into the 600V convertor-inverter-brake and 1200V inverter (six-pack) modules, providing IGBT driving without an optocoupler.

The SOI technology provides complete latch-up immunity, since all switches are di-electrically insulated.

A level shifter for each channel allows the presence of negative secondary offset voltages.

The integrated gate driver remains fully operational for any applied offset voltage down to -50V, providing flexibility in the design of a power system.

The gate driver IC features overcurrent shutdown circuit protection by using an external shunt resistor in the ground plan as well as an under-voltage lockout for all channels and fault signalling.

A shut-down can also be forced by the system controller, using the shutdown input.

Logic interlock protection is included to ensure that simultaneous conduction of the IGBTs in a phase leg cannot occur.

The MiniSKiiP IPM is suitable for industrial and consumer drives up to 15kW as well as process control and solar applications.

Using Trench-Field-Stop IGBTs, the IPMs are available in 600 and 1200V versions and have been designed for nominal current ratings of up to 72A.