Renesas begins designing low power Sram devices
Renesas Technology
Sram devices
Renesas has started to develop fast and low power Sram products for automotive applications.
They are available as 4, 16 or 32Mbit low power Sram and 4Mbit fast Sram devices.
They feature a copper lead frame to operate reliably between -40C and +105C.
This provides a stronger solder joint that closely matches the temperature coefficient of a printed circuit board (PCB).
The devices will shortly meet the automotive specific production part approval process (PPAP).
This accreditation is used in the automotive supply chain to establish confidence in component suppliers and production processes.
The ICs are also undergoing certification against the Automotive Electronic Council Q100 (AEC-Q100) standard that establishes the stress qualification for integrated circuits.
Mass production of the devices will begin in July 2009.
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