Mobile-ITX creates portable embedded devices
VIA Technologies
Mobile-ITX
VIA Technologies has announced Mobile-ITX, a VIA-developed open-form-factor specification for the creation of ultra-compact and portable embedded devices.
It defines a 6 x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.
Mobile-ITX employs a modularised design that includes a CPU module card and an I/O carrier board.
This offers greater flexibility for developers who can drop in the CPU module to a custom designed, application-specific carrier board.
CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality, and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals through customisable baseboards.
Mobile-ITX-based modules consume as little as 5W, suitable for always-on, mission-critical systems.
The range can be implemented on a variety of Mobile-ITX compatible carrier-board designs that can be adapted to suit almost any environment, or application-specific criteria.
The CPU module I/O signals are mapped to two high-density, low-profile connectors on the underside of the module, with a distance between the CPU module and the baseboard of 3mm, making it suitable for ultra-slim system designs.
The connectors can also withstand vibrations of up to 5Gs, making Mobile-ITX systems suitable for in-vehicle and industrial-machining applications.
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