Infineon announces MIPAQ modules

The MIPAQ (modules integrating power, application and quality) base module integrates an IGBT six-pack and current sense shunts and is suitable for use in low-induction system designs in industrial drives and servos up to 55kW.

The MIPAQ base module is characterised by enhanced testing and is delivered as a known-good system.

At 17mm in height, the company said that its MIPAQ base module enables highly efficient and compact power inverter designs of high ruggedness at an excellent price/performance ratio.

The module integrates three specifically designed shunts for current measurement.

The integrated shunts handle all tasks formerly performed by external current sensors, which are costly and require valuable space.

They allow its applications to greatly benefit from board space savings of up to 20cm2 and elimination of PCB hotspots.

Physical effects such as hysteresis or offset do not exist.

The integrated shunts also generate less heat on an inverter's PCB.

The integration into the MIPAQ base module provides better heat distribution to the heatsink.

Using Infineon's Trenchstop/fieldstop IGBT4 chip technology with emitter controlled diodes, MIPAQ base modules feature a nominal current of 75A, 100A and 150A in a 1,200V class for the six-pack configuration with NTC resistor for temperature sensing.

The maximum operating junction temperature is +150C.

They are available in Infineon's Econopack 3 housing and are RoHS compliant.