Fujitsu unveils mobile WiMax device

MB86K23 is the next-generation MB86K21, which targeted embedded WiMax in mobile PCs or in WiMax PC cards and is certified by the WiMax Forum.

MB86K23 allows a 60 per cent reduction in chip-set area compared to its predecessor.

When combined into a chip-set with FME's RF device, MB86K52, and power management device, MB39C316, very small form-factors can be realised - 20mm x 40mm for WiMax USB dongles or 30mm x 26.8mm for PCI Express half-mini cards containing both WiMax and Wi-Fi functionality.

ODM vendors are already planning to release such products using this WiMax baseband device.

The use of 65nm process technology in the manufacture of the MB86K23 enables a 36 per cent reduction in power consumption during operation compared to the MB86K21.

Key features of the MB86K23 include low-power consumption due to 65nm CMOS and power gating technologies.

In addition, the power gating technology Cooladjust-PG, which was jointly developed with Fujitsu Laboratories, has been used in this device.

This allows power to be switched-off to circuit blocks that aren't in use, enabling the standby current of the complete WiMax module to be kept down to 0.5mA, which will allow a longer battery life for mobile WiMax devices.