TEE announces SSD modules with 32nm MLC NAND flash

The Toshiba SG2 modules are offered in two types, one based on the low-profile mini-SATA (mSATA) interface standard and the other a Half-Slim type, which uses a SATA connector.

The drives are available in 30 and 62GB modules.

The 62GB module is one seventh of the volume and one eighth of the weight of a 2.5in form-factor SSD, and consumes half the power.

With interface speeds up to 3Gb/s, a maximum sequential read speed of 180MBps and a maximum sequential write speed of 50MBps, the modules help to bring the performance advantages of SSDs to notebooks, portable electronics and embedded systems.

An advanced controller features a translation mode that enables any drive configuration and the drive supports 28bit LBA (Logical Block Address) mode commands and 48bit LBA mode commands.

Multi-word DMA, Ultra-DMA modes and Advanced PIO commands are supported.

The drives have an optional capability for secure Full Disk Encryption (FDE) backup that prevents unauthorised data access.

The mSATA modules leverage the speed and reliability of the SATA interface in a small form-factor module, 1.18 x 0.19 x 2in (30 x 4.75 x 50.95mm), that connects to the system board using the low-profile SATA connector.

Adaptive Power Mode and SATA Device Initiated Power Management typically reduce power consumption to less than half of the Read power level when the device is in idle, standby or sleep mode.

The Half-Slim SATA II modules have the same SATA connector used on 2.5in HDD and SDD form factors, measuring 1.18 x 0.19 x 2in (54 x 4 x 39mm).

This smaller form factor can be used in applications designed to use 2.5in storage form factors.

The Half Slim is also compliant to JEDEC SFF 8156.