Power semiconductor comes in three-level topology

The module features a rated current of 4.9A/cm and one phase leg per module, enabling the development of compact inverters with output power of up to 85kVA.

The MINISKIIP is characterised by the fast and easy single-screw assembly and therefore optimised for the efficient manufacture of three-level solar inverters and UPS systems.

The rated current per unit of area is up to twice that of other three-level modules, according to the company.

Since no solid busbars are needed between the three phases/modules, more compact inverters can be made.

The reverse voltage of the IGBTs and diodes used has been increased to 650V to enable DC link voltages of 900V for 480V three-phase power applications typical in commercial or industrial settings in the US.

Each module has a three-level phase leg with sufficient space for 10 power semiconductors each.

Thermal and electrical connection between the module, the heat sink and the driver board is established with a single screw or two screws for rated module currents of up to 150 or 200A, respectively.

This means that solder equipment and time-consuming soldering processes are done away with in the assembly stage.

For solar-inverter output power of 60kVA and above, modules with screw connections were previously used for the busbars.

With MINISKIIP 200A three-level modules, the busbars can be replaced with cheaper PCBs in inverters with outputs of up to 85kVA.

Former complex eight-screw connections have been reduced to simple two-screw-assembly solutions.

The three-level product range from Semikron covers rated currents of 20 to 600A: featuring SEMITOP solder modules for up to 150A, MINISKIIP spring contact modules for up to 200A and SKIM screw connection modules for up to 600A.