IGBTs provide alternative to solder connections

The housing design of the Smart modules allows deploying self-acting PressFIT technology to assemble a Smart module to the printed circuit board and to the heat sink in a single-step mounting process using one screw only.

The range offers a high quality and reliable alternative to today's solder connections, fulfilling the needs of inverter designs in the range of up to 55kW.

Smart modules enable power-converter system solutions optimised for: various general-purpose and variable drives, uninterruptible power supply (UPS), inductive heating and welding equipment, solar inverters and air-conditioning systems.

The combination of the PressFIT technology with the self-acting assembly and mounting to the heat sink simplifies the manufacturing process and reduces manufacturing time to a few seconds.

By tightening the screw, the counter holder presses the PressFIT pins into the holes on the PCB.

This generates a cold-welded and reliable gas-tight connection.

The module is mechanically fixed to the heat sink and the PCB onto the module.

The housing has an inner module core and an outer frame, which secure the sensitive components such as IGBT chips, diodes and the ceramic; this prevents DCB (direct copper bonding) cracks.

The IGBT Smartpack1 (six-pack configuration) and Smartpim1 (six-pack configuration with input rectifier and brake chopper) are the first members of the Smart family of power modules, covering an inverter power range from approximately 2.2 to 11kW.

With Smartpim2, Smartpack2, Smartpim3 and Smartpack3, which will follow later, the range will cover a current range of up to 200A distributed over the different housing sizes.

Therefore, Smartpim and Smartpack modules are available for inverters ranging up to 55kW.

Samples of the Smart modules will be available in the third quarter of 2009, with start of production scheduled for the fourth quarter.