Ultra-miniaturised wafer-level chip scale packages
Nordic Semiconductor
Ultra-miniaturised wafer-level chip scale packages
In Q1 2011 Nordic Semiconductor will release a set of WLCSPs for space-constrained sports, fitness and health applications worn near the body such as watches, bike computers, sensors and hearing aids.
New one- and eight-channel nRF24AP2 WLCSP package options will be tiny single-chip ANT solutions (nRF24AP2-1CHC32 and nRF24AP2-8CHC32) featuring 400um pitch (regular array), 32-ball BGAs with a thickness of 0.5mm and a flat footprint area of just 2.6 x 2.7mm that is more than five times smaller than the footprints of competing 6 x 6mm (36mm2) packaged products.
The new nRF24LE1 WLCSP option (Flash or OTP) will be a 400um (regular array) 32-ball pitch BGA measuring 2.7 x 2.7mm in footprint area for the Flash version and 2.6 x 2.7mm for the OTP version.
Both devices are 0.5mm in thickness.
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