Receiver subsystems bridge expertise gap

The LTM9001 is the first in a new series of system in a package (SiP) signal chain receiver modules from Linear Technology that use the company's breakthrough uModule packaging technology.

This new family of integrated receiver subsystems is intended to bridge the expertise gap between the RF world and digital domain to provide ease of use and shortened time to market.

The LTM9001 is a semicustomisable IF/baseband receiver subsystem that includes a high performance 16bit A/D convertor sampling up to 160Msample/s, an anti-aliasing filter and a fixed-gain differential ADC driver.

The LTM9001 harnesses years of applications design experience to offer integration, ease of use with guaranteed high performance to enhance system performance in many communications and instrumentation applications.

Sampling high dynamic range signals in RF applications requires extensive experience to maximise the full capabilities of the A/D convertor.

An intimate knowledge of the amplifier output stage and ADC front end is required to match the impedances, while careful attention to layout is required to minimise coupling of the digital outputs into the sensitive analogue input.

Degraded ADC performance can in many cases be attributed to bad layout.

These considerations can challenge the engineer whose expertise lies in the RF or digital worlds.

The LTM9001 transfers this burden of component selection, input impedance matching, filter design and layout from designer to device, shortening overall design time, system troubleshooting and ultimately improving time to market.

The beauty of the LTM9001 lies in its semicustomisation (customisation requires minimum order quantity).

Using pin-compatible product families, the LTM9001 can be configured for various sampling rates and the differential ADC driver can be substituted for fixed gain versions ranging from 8 to 26dB.

The anti-aliasing filters can also be configured as lowpass or bandpass filter versions, accepting input frequencies as high as 300MHz.

The LTM9001 is packaged in a space-saving 11.25 x 11.25mm LGA package, utilising a multi-layer substrate that shields sensitive analogue lines from the digital traces.

The LGA pads are positioned on the bottom of the package so that input and clock signals are separated from the digital outputs, simplifying the layout for the designer.

Bypass capacitance is placed inside the module and close to the die, providing a space, cost and, more significantly, a performance advantage over traditional packaging.

With no external capacitance required, the LTM9001 consumes approximately half the space of the discrete implementation.

The LTM9001 is available in production volumes today and is priced at US $82.00 each in 1000 piece quantities.