Fujitsu introduces range of wireless modules
Fujitsu Componentscontact supplier
Fujitsu Components Europe has introduced a range of wireless modules.
The wireless-module product range has recently been taken over from Fujitsu Media Devices and will soon be available on the European market.
The company will offer WLAN, Bluetooth and GPS modules, as well as WLAN/Bluetooth combination modules, for embedded solutions.
The modules are available as surface-mount and connector-joint types and can be equipped with an ultra-wideband antenna.
The WLAN module for embedded applications using Windows CE, embedded Linux and Itron operating systems can include ARM core, MIPS core and Fujitsu and other processors.
WLAN modules for PC/UMPC applications using Windows XP, Windows Vista and Linux operating systems can include x86 PC: Intel Pentium Core2Duo or x86 UMPC: Intel Atom, Via Isaiah.
The lower-power 11b/g module includes the Marvel 88W8686 IC and the draft 11n USB module, the Ralink RT 3070.
For the combination with Bluetooth, Fujitsu has chosen the CSR BC4-Rom and the Marvell 88W8686.
The Bluetooth modules are available in surface-mount or connector-joint types in power class 1 and 2 with or without an integrated antenna.
The Bluetooth SPP serial port profile (SPP) module (power class 1 and 2) has been designed upon an external-based CSR Blue Core 4.
Thanks to the incorporation of the upper-level protocol stacks and SPP, users can control Bluetooth via text base commands.
The Bluetooth SPP modules are a cost-efficient solution, reducing development time and costs, according to the company.
The GPS modules include the SiRF star III chip, which is able to decode GPS signals at low signal levels.
This data sheet details the features and specifications of Fujitsu Components’ 240R series of board-to-board connectors. It also provides information on dimensions and layouts.
Fujitsu Technology has introduced a range of industrial-grade mainboards with LGA1150 sockets for the 4th generation Intel Core processors. It includes one board each with the form factors ATX, µATX and Mini-ITX, all with an Intel Q87 chipset. There is also a cost-optimised ATX board with an Intel H81 chipset. Their long product lifecycle makes the boards suitable for use in the capital goods sector.
Fujitsu Components is offering the 240 series of board-to-board connectors. The series includes a four-row multi-contact type, an SMT type and a wide tapered type.
Fujitsu Components is offering the 230R series of connectors for board-to-cable connection. The 1.27 x 2.54mm pitch contact arrangement enables high-density mounting.
This data sheet details the features, specifications and applications of Fujitsu Components’ 230 series of board-to-board connectors.