Toshiba introduces bridge chips for mobile phones
Toshiba Electronics
Bridge chips
Toshiba Electronics has launched three bridge chips for use in mobile phones.
These include a Mobile Industry Processor Interface (MIPI) camera serial interface (CSI) to a Mobile Display Digital Interface (MDDI) chip (TC358740XBG) and two MDDI-MIPI display serial interface (DSI) chips (TC358760XBG and TC358761XBG).
These products provide high-speed serial interfaces between a mobile phone's baseband or application processor and the phone's display or integrated camera, and are a requirement for high-resolution displays and cameras used in smartphones, mobile internet devices, netbooks, smartbooks and other high-performance mobile devices.
They are the latest additions to Toshiba's Embedded Mobile Peripheral SoC lineup.
With their support of high-speed MIPI and MDDI interfaces, Toshiba's bridge chips will allow customers to design mobile devices that can easily handle high-bandwidth communication between the phone's display, camera and baseband or application processor, said to give consumers an uncompromised video experience.
The TC358740XBG camera bridge chip provides connectivity for MIPI cameras to baseband or application processors using an MDDI interface.
The bridge chip supports MDDI 1.2 Type 2 on the host side.
The device offers support for up to two cameras, with the primary camera using a MIPI link and the secondary camera using a MIPI link or parallel port.
The bridge enables high-speed serial interfaces on the host via MDDI and camera side via MIPI CSI-2, allowing support for up to 12 megapixel primary camera and up to 2 megapixel secondary camera in one handset.
It is compatible with systems using Qualcomm baseband processors with an MDDI interface.
The Toshiba TC358760XBG and TC358761XBG display bridges are optimised for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface.
They are based on the MDDI 1.2 Type 1 and MIPI DSI 1.01 interfaces, but are backward compatible with MDDI 1.1.
They support direct refresh through the MDDI link.
In addition, the TC358761XBG offers support for legacy parallel interfaces such as a MIPI DPI and an MIPI DBI on the host side or the panel side, allowing reuse or extended use of existing design and components.
These devices are compatible with systems using Qualcomm baseband processors with an MDDI interface.
More stories
Toshiba IC enables enhanced display capabilities
Toshiba Electronics Europe has expanded its family of mobile peripheral device ICs with the TC358751XBG, enabling mobile products manufacturers to provide users with enhanced display capabilities.
Maxim Integrated Products set to roll out line of RFID ID systems
Maxim Integrated Products is introducing a line of RFID keys and cards designed for the automatic identification, access control and electronic markets.
TTI offers Euro-style terminal blocks suitable for demanding applicationsdownload
TTI’s range of terminal blocks from FCI has been expanded with a range of PCB fixed configurations, power-pluggable and spring-contact products suitable for demanding applications.
Linear Technology releases RF-to-digital receiversdownload
Linear Technology has introduced two RF-to-digital Umodule receivers that integrate the key components for 3G and 4G basestation receivers and smart antenna Wimax basestations.
Turck gateways for in-the-cabinet distributed I/O
Turck has launched BL20 Economy gateways for Ethernet/IP and Modbus TCP, which can be paired with a range of I/O slices to suit virtually any application's communications and transparency needs.
