Oxford unveils PCI Express multi-port bridge
Oxford Semiconductor
OXPCIe200 multi-port bridge
Oxford Semiconductor has introduced the OXPCIe200 PCI Express multi-port bridge.
The OXPCIe200 offers designers a range of options for PCI Express bridging that can be used together or in isolation to connect subsystems to a PCIe-based system.
Targeting the bridging, device control and IO expansion needs of industrial control, PC peripherals, Expresscard modules, point-of-sale terminals, servers, communications systems and embedded designs, the OXPCIe200 provides the bridging power required for inter-processor communication and device control in these PCIe-based systems.
It has a connectivity set comprised of a USB 2.0 host port, a port configurable as a USB 2.0 host, SPI or Sram interface and a UART port.
The single-chip device has been designed to achieve the high-level system performance required by demanding bridging applications, while at the same time offering fast, easy design-in.
This device delivers up to 62.5Mbytes/s data throughput and low CPU utilisation at a 30 to 40 per cent cost saving, while also claiming to save designers from three to six months of development time.
The OXPCIe200 delivers a choice of intermediate bridging formats that make it suitable for a diverse range of applications and with support for multiple data pipes, multi-channel DMA and MSI-X interrupts.
It also includes the addition of active state power management (ASPM), a digital (Phy-less) interface using a reverse ULPI port, PCI power management (including wake up from D3cold) and industrial temperature range.
These features make the OXPCIe200 suitable for power and temperature sensitive Expresscard and Minicard designs.
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