Allegro IC senses currents of 12.5-25A nominal

The company said the IC provides an economical and precise means for current sensing applications in industrial, commercial and communications systems.

The device consists of a precision linear Hall sensor IC with a copper conduction path located near the surface of the silicon die.

Applied current flows through the copper conduction path, and the analogue output voltage from the Hall sensor IC linearly tracks the magnetic field generated by the applied current.

This packaging configuration is said to give optimum accuracy because the Hall element is situated very close to the current being measured.

In addition, the current conduction path is electrically isolated from the low-voltage sensor inputs and outputs.

This allows the ACS710 family to be used in applications requiring electrical isolation without the use of opto-isolators or other costly isolation techniques.

Allegro's integrated shield technology leads to a high degree of immunity to voltage variations and stray electric fields in the current conductor, guaranteeing low output ripple and low offset drift in high-side, high-voltage applications.

The voltage on the over-current input allows customers to define an over-current fault threshold for the device.

When the current flowing through the copper conduction path exceeds this threshold, the open drain over-current fault pin will switch to a logic 'low' state.

The internal resistance of the copper path used for current sensing is typically 1milliohm, leading to low power losses.

The ACS710 can sense currents of 12.5-25A nominal and inrush peak currents three times higher than nominal, making it ideal for motor control applications.

Other application areas include uninterruptible power supplies, power-supply protection, IGBT modules, energy metering and white goods controls.

Factory programming of the linear Hall sensor IC in the ACS710 is said to result in high accuracy in both analogue and digital output signals.

The device is offered in a small footprint surface-mount package said to allow easy implementation in customer applications.