Heatsinks and thermal management
Product & Service Resources
Digi-Key offers device to help prevent thermal damage caused by failed power components
Digi-Key is offering TE Connectivity’s Reflowable Thermal Protection (RTP) device, which, claimed to be the industry’s first SMD thermal protector, helps prevent thermal damage caused by failed power components.
Air management systems enhance cooling in AdvancedTCA/MicroTCA shelves
Rittal has developed a range of air management systems that are designed to enhance the cooling performance in AdvancedTCA and MicroTCA shelves by eliminating escaping airflow.
Ohmite releases MV/MA 302 heatsink with fin extensions for thermal performance
Ohmite has released a larger version of its MV/MA 102 heatsink, the MV/MA 302.
Wika introduces two ranges of resistance thermometers for sanitary applications
The TR21 and TR22 series of resistance thermometers from Wika Instruments are suitable for sanitary applications and can be integrated into all standard processes.
Heat sink's push-pin mounting system enables safe attachment onto hot components
Advanced Thermal Solutions (ATS) is offering Maxiflow heat sinks with an integral push-pin mounting system for the fast, safe attachment of the heat sinks onto BGAs and other hot components.
Outdoor cooler uses bi-polar thermostatic control
Laird Technologies has announced the release of its outdoor thermoelectric cooler series with bi-polar thermostatic control.
EMI shielding for medical device enclosures
Chomerics Europe - a division of Parker Hannifin - has launched Soft-Shield 4850, an EMI shielding material that is suitable for medical applications using electronics equipment for patient care.
Mosfet packaging features top-side cooling
In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor has developed the Dual Cool packaging for Mosfets.
Heat sinks have good heat-dissipation properties
Amec Thermasol has launched a range of micro porous ceramic heat sinks (MPCHS) for high-volume applications such as LED/LCD TVs, computer monitors, set-top boxes, motherboards, media players and more.
Thermal gap filler has low out-gassing properties
Laird Technologies has released the Tflex XS400 series thermal gap filler designed for telecom, IT, consumer, automotive, LED and power supply applications.
