IC and hybrid processing equipment
Product & Service Resources
SPP supplies Pegasus DSi Deep Silicon etch system
SPP Process Technology Systems | Tue, 1 Jun 2010
SPP Process Technology Systems (SPTS) has received an order for a Pegasus DSi Deep Silicon etch system, supported on the Omega FXP cluster platform, for a 3D-IC through silicon via (TSV) application.
SM packages suit optical devices in aerospace apps
Stratedge | Fri, 28 May 2010
Stratedge's SM range of packages fits aerospace, avionics, automotive and telecom-industry applications, and is especially suited for LEDs, MEMS and optical devices.
Nanofab tool influences nanostructure growth
Oxford Instruments Plasma Technology | Fri, 4 Sep 2009
Oxford Instruments Plasma Technology (OIPT), has launched the Nanofab800Agile System.
DEK introduces wafer-processing system
DEK | Mon, 3 Aug 2009
DEK has developed the Galaxy thin silicon wafer processing system.
Oxford Instruments releases HVPE reactor
Oxford Instruments Plasma Technology | Fri, 15 May 2009
Oxford Instruments has launched Crystalflex, a multi-wafer hydride vapour-phase epitaxy (HVPE) reactor.
Atmel develops cryptographic authentication ICs
Atmel | Wed, 29 Apr 2009
Atmel Corporation has announced its AT88SA range of low-cost, ultra-low power, super-secure cryptographic authentication ICs.
Oxford Instruments produces semi-polar GaN layers
Oxford Instruments Plasma Technology | Wed, 11 Mar 2009
The technical team at Oxford Instruments-TDI, led by Dr Alexander Usikov, is working closely with a light-emitting diode (LED) manufacturer to make semi-polar GaN layers for optoelectronic devices.
ALD tool improves solar cells
Oxford Instruments Plasma Technology | Tue, 17 Feb 2009
Researchers have developed a thin-film coating providing an unparalleled level of surface passivation of crystalline silicon solar cells, using Oxford Instruments' FlexAL ALD tool.
